In the dynamic landscape of electronics, innovation is paramount to address the demands of miniaturization, automation, and hyperconnection.
Following this trend, LATI developed a new thermoplastic compound: V0HF1X, a revolutionary solution for self-extinguishing at low thicknesses.
New trends in electronics highlight the rise of complex, integrated applications in compact housing. The progressive reduction in plastic wall thicknesses, often by a few tenths of a millimeter, requires advanced materials that can guarantee high mechanical, electrical, and thermal performance along with solid resistance to fire, glow wire, and creeping currents.
LATI's renowned portfolio of flame-resistant compounds, with minimal environmental impact, is known as V0HF1. Available across PA6, PA66, PBT, and PPA, these compounds boast UL94-V0 certification for thicknesses up to 0.75 mm, GWIT 775°C at 1 and 2 mm, and a creep current resistance (CTI) of 600V.
For demanding sectors, such as next-generation connectivity or integrated electronics with demanding over-molding requirements, LATI has developed V0HF1X. This innovative family of glass-fiber reinforced PA66-based compounds ensure self-extinguishing capabilities up to thicknesses of 0.4 mm without compromising other properties. Leading the charge is LATAMID 66 H2 G/25-V0HF1X, the first product in this line. Engineered for high mechanical performance and strict electronic safety standards, it maintains optimal mechanical properties, rendering it suitable for snap-fit assemblies and high-stress applications.
For further information, please visit our dedicated page on self-extinguishing materials or contact us.